Silicon Oxide and Silicon Nitride

Pattern Photoresist Silicon Silicon Nitride Silicon Photoresist Silicon Nitride Silicon Etch Nitride Remove Photoresist

In this proposal we seek to establish a porous silicon based etching process in the WTC microfabrication laboratory. The new process will allow us to etch high aspect ratio holes through a wafer. Holes like these are important for decreasing the dead volume of connections between micro and macro systems and for increasing the complexity of micro-fluidic systems. At the present time, the minimum...

Guided photoluminescence study ofNd-doped Silicon Rich Silicon Oxide and Silicon Rich Silicon Nitride waveguides

Planar waveguides made of Nd 3+ -doped silicon rich silicon oxide (SRSO) and silicon rich silicon nitride (SRSN) have been fabricated by reactive magnetron sputtering and characterized with special emphasis on the comparison of the guided photoluminescence (PL) properties of these two matrices. Guided fluorescence excited by top surface pumping at 488 nm on planar waveguides was measured as a f...

Silicon Nitride and Silicon Carbide

The scaling-down of twin Silicon-oxide-nitride-oxide-silicon (SONOS) memory

transistor has been extensively studied and its application to multi-bit/cell Flash device has been also presented. The scaling issues of SONOS memory is generally addressed in terms of both NAND and NOR Flash application. In the case of NAND SONOS Flash, there are some significant process integration issues about selection transistor, contact resistance, gate filling process margin, and dielec...

MICROSTRUCTURAL STUDY OF SILICON NITRIDE WHISKERS PRODUCED BY NITRIDATION OF PLASMA-SPRAYED SILICON LAYERS

plasma-sprayed silicon layers have been used to produce silicon nitride layers with fibrous microstructure which optimizes fracture toughness and strength. SEM examination of the specimens shows that the surface is covered by fine needles and whiskers of Si3N4.In order to study the oxygen contamination effect as well as other contaminants introduced during spraying and nitridation processes, su...